Driven by the explosive demand for AI computing power, large-die packaging is sparking a fundamental paradigm shift across the semiconductor industry. As market leaders push advanced packaging beyond 2.5D wafer-level into panel-level architectures and 3D stacking, second-tier foundries are actively following suit by deploying key technologies such as TSV and Wafer-to-Wafer bonding. With over ten new advanced packaging facilities already planned by foundry providers worldwide, the industry has officially entered the Foundry 2.0 era. Looking ahead to 2027, advanced packaging evolves from an auxiliary service into a primary competitive differentiator, fundamentally reshaping global market dynamics, value distribution, and competitive strategies across the foundry landscape.

AI-driven demand continues to reshape the DRAM market, with growing requirements for both computing performance and memory capacity. However, limited near-term capacity expansion, together with the increasing wafer consumption of HBM, is expected to keep DRAM supply constrained and support higher memory prices.
As memory costs rise, customers are increasingly reassessing memory configurations to balance system performance with total system cost. This trend is already visible across server DRAM and HBM, where some customers have begun evaluating lower-capacity configurations or alternative memory specifications in response to both supply constraints and higher procurement costs.
Against this backdrop, explores how DRAM and HBM demand will evolve under limited supply, focusing on the trade-off between performance, memory capacity, and cost. We will examine how capacity allocation, product mix, and customer configuration adjustments could reshape memory bit demand and ultimately determine the next growth drivers for the DRAM and HBM markets.

Driven by the explosive growth in AI computing power, LPDRAM has evolved from a simple component for mobile devices into a core strategic resource for AI infrastructure. As tech giants including NVIDIA and AMD increasingly adopt LPDDR5X—leveraging its superior power efficiency to partially replace standard DDR5—it has become a critical pillar supporting AI servers and edge computing. In response to this structural shift, the top three DRAM suppliers are also aggressively deploying advanced process technologies, effectively redrawing the competitive landscape of the memory industry.