Overview
AI has moved beyond trend status—it is now the central force accelerating a new wave of electronics innovation, fueling progress from near-eye displays and autonomous robotics to HBM memory, advanced MLCCs, and AI-optimized semiconductor manufacturing.
As the global tech sector enters a phase of structural transformation, the convergence of AI, rising performance demands, and manufacturing complexity is reshaping every layer of the electronics value chain. In response to shifting market dynamics, companies are rethinking materials science, packaging architectures, fabless-foundry collaboration, and end-to-end supply chain strategies.
TrendForce Roadshow Korea presents a holistic analysis grounded in the dynamics of the full electronics value chain. Backed by our in-house analysts' insights, this event highlights how emerging technologies are reshaping industry structures and where momentum is building across an AI-native future.