AR 智慧眼鏡的關鍵製程技術：晶圓鍵合與奈米壓印
Key Process Technologies for AR Smart Glasses: Wafer Bonding and Nanoimprint
李昱瑩
EV Group Taiwan Ltd. / 總經理
Augmented Reality (AR) is driving demand for microLED displays with exceptional performance, ultra-high pixel density, and compact form factors—requiring advanced semiconductor manufacturing tehnologies. EV Group (EVG) addresses these needs with a versatile portfolio of wafer bonding technologies, including wafer-to-wafer and die-to-wafer solutions that enable precise, scalable microLED integration for AR/VR and microdisplay applications. EVG’s SmartNIL® nanoimprint lithography complements this by enabling high-resolution patterning of optical structures and functional layers, such as waveguides, essential for AR smart glasses. This presentation highlights key manufacturing innovations that support scalable production of microLEDs as well as nanostructured optical components for next-generation wearable devices.