Micro Compuforum 2018

2018/6/6 ,TICC


About Compuforum 2018: Edge Computing – The Future of Memory and Cloud

The traditional cloud infrastructure has led the way in the computing services for many years and brought forth new opportunities such as cloud storage and big data analyses. However, the same cloud infrastructure is now under strain to handle vast amounts of data that are being produced in real time. Within this context, edge computing emerged as a major field in 2017 and has continued to capture market attention since then. Edge computing not only reduces the workload of the traditional cloud infrastructure but also raises the processing capabilities at the endpoints. Advantages that edge computing provides, such as significant increases in computing efficiency and utilization of data, will contribute to the development of other emerging fields of technologies, especially AI and 5G.

Global market intelligence firm TrendForce forecasts that the total scale of the market for technologies related to edge computing will expand at a CAGR of more than 30% from 2018 to 2022. The ascendency of edge computing will have enormous impacts on the rest of the technology sector, including manufacturers of cloud computing hardware and memory components.

TrendForce’s annual Compuforum is held concurrently with COMPUTEX in Taipei, Taiwan. The 2018 Compuforum will be focusing on how edge computing will affect developments in the cloud infrastructure, the memory industry, and the IoT ecosystem. This and other related hot topics will be presented by the TrendForce analyst team and guest speakers from globally renowned technology providers such as Western Digital and ADATA. Attendees will receive important news on the development of the cloud networks as well as information on advanced solutions offered by the industries. Avril Wu, chief analyst from TrendForce’s DRAMeXchange, will also be there to share her view on the latest trends in the memory and storage market.

Admission to this must-attend conference is free. Registration is required because seating is limited, so sign up early as not to miss out on this great opportunity!

About Compuforum 2018

  • Date: June 6, 2018

  • Time: 13:00-17:00

  • Venue: 4F VIP Room in the Taipei International Convention Center (TICC)

  • Address: 1 Hsing-Yi Road, Section 5, Taipei City, Taiwan ROC

  • Language: English (simultaneous interpretation will not be available)

  • Fee: FREE! Advanced registration is required.




C.L. Liu,Chairperson



Edge Computing: The Future of Cloud and Memory Technologies

Christopher Bergey, Senior VP and GM of Embedded Solutions of Western Digital

Western Digital


Data is everywhere, data is being created at an astounding rate, much of today’s economy is focused on releasing the power of this data. The world of artificial intelligence and 5G are dramatically changing how data is created, processed, stored, and utilized. And the complexity of data (content and context) is pushing the capabilities of the today’s cloud framework. Consumers and corporations alike are utilizing new data driven applications while demanding more control over their data. These emerging usages add to need of an evolution, if not revolution, of the computing network architecture. Edge computing, with the significant progress and improvement on sensors, clients, gateways, and the interoperation among them, shapes the future of cloud and memory technologies and the valuable data within.


SSD Solutions for Cloud Computing

Neo Yin, Director of Product R& D Group



With respect to the continuous growth of Cloud Computing, ADATA introduces the latest SSD solutions for cloud computing and an automatic test software.
The NGSFF, U.2 and HHHL AIC SSD was designed by ADATA targeting at Cloud Computing application as it requires extremely high IOPS and stable performance.
SNIA PTS(performance test specification) is one of specification of enterprise solid state storage performance test. ADATA’s bases on SNIA PTS to develop automatic test software for applications such as cloud computing, high performance computing, bug data, database and so on. All solid state storages can be tested by this software to evaluate the feasibility of solutions.


Addressing the Diversified Requirements in Edge Computing

Jeffrey Ho, Senior Marketing Manager



As data continues to grow at astounding rates, it is creating demand for even greater bandwidth. Trends such as IoT, the connected car and planned roll-out of 5G networks will put strain on today’s network infrastructure funneled to the cloud, driving the need for networking and storage services and workloads at the edge of the network. The multitude of intelligent and compute-intensive applications across industrial, enterprise, IoT and mobile devices has also created a diversity of use cases needing various processing power, security and virtualization capabilities. This session will discuss the compute and I/O requirements in which scalability is critical in order to maximize and leverage the investment in hardware and software. To address these diversified requirements, the session will introduce a modular architecture and solutions approach to edge computing that integrates Armv8 technologies; CPU, PHY and switch offerings; and a robust software ecosystem.




The Role of New IoT Platforms in Tech Ecosystems

Tino Hildebrand, Vice President of Digital Factory / Process Ind. & Drives Division



Siemens will emphasize how digitalization, data analysis have transformed traditional market to digital market to improve efficiency and safety in production processes. In addition, Mr. Hildebrand will take this opportunity to introduce MindSphere, the cloud based, open IoT platform, explaining how this powerful operating system can create a new business model and generate remarkable profit.


Memory Development in the Age of Cloud

Avril Wu, Senior research director of DRAMeXchange, a division of TrendForce



With IoT and AI shaping everyday life in the future, TrendForce anticipates that data gathering and collaborative robot technologies will bring much convenience to our daily activities following their maturation in the next 5-10 years. For now, these technologies are still at their early stages of development, and associated solution suppliers are engaging in R&D to create products suitable for related applications. Among the hardware components, DRAM and NAND Flash are playing key roles respectively in computing and data storage tasks. As memory makers continue to develop solutions that meet the demands for higher clock speed and greater power saving, they are also recognizing the physical limitations of the existing manufacturing technologies. The constant pressure to reduce costs while maintaining the pace of innovation is expected to become a major challenge confronting memory makers that seek to unlock the huge business opportunities within this decade.

The agenda is preliminary and subject to change without notice.


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Christopher Bergey

Western Digital

Senior VP and GM of Embedded Solutions of Western Digital

Christopher Bergey is Vice President of the Embedded and Integrated Solutions group at Western Digital. In his role, he is responsible for developing and driving Western Digital’s embedded storage solution strategies in the mobile and connected market segments, including smartphones and tablets, automotive, industrial, connected home and other connected, “Internet of Things” environments.
Prior to joining Western Digital, Bergey served in senior management and marketing roles for Luxtera, Broadcom, Multilink Technology Corporation and Advanced Micro Devices. Bergey received his Bachelor of Science in Electrical and Computer Engineering from Drexel University and his Master of Business Administration from the University of Maryland.

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Neo Yin


Director of Product R& D Group

Neo Yin has been the Director of Product R& D Group at ADATA Technology, which is one of the world’s largest vendors of DRAM modules and Flash product since Jun 2016. Neo is responsible for Flash & Consumer electronics product development, including SSD, USB drive, SD card, external SSD/ HDD, Power bank, smartphone accessories with App for Android/ iOS.
Previously, he was General Manager of Storage Product Development Center at Beijing Fortunet Technology from Aug 2013 to May 2016, managed R& D and Product Management Division, delivered External Disk Storage product and OpenPOWER server solution for Teamsun Technology.
Before that, he was Hardware(N series) Architect at IBM, responsible for the definition of external NAS, SAN strategy and road map; Collaborating with 3rd party OEM for product development and obtaining partnership, etc. Neo has joined Server/ Storage industry since 1998 with depth insight in Hardware architecture.

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Jeffrey Ho


Senior Marketing Manager

Jeffrey Ho is a senior marketing manager at Marvell for Marvell switching, PHY and embedded processor product portfolios for universal CPE and edge compute solutions in the Japan, Korea and Taiwan regions. Jeffrey joined Marvell in summer 2017. Previous to this, he was a business development manager at Motorola, Freescale and NXP, respectively, with focus in embedded processor, wired and wireless networking production. He has over 20 years of experience in the semiconductor industry of which included 12 years in technical marketing. Jeffrey graduated from the University of New South Wales in Australia with an Electrical Engineering degree in microelectronics.

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Tino Hildebrand


Vice President of Digital Factory / Process Ind. & Drives Division

Mr. Tino Hildebrand is serving as Vice President of Digital Factory / Process Ind. & Drives Division, Siemens Ltd., Taiwan. During his previous position as Director of Factory Automation and Process Automation, Siemens Ltd, Mr. Tino Hildebrand gained his comprehensive know-how and experiences about Taiwanese industrial market. In addition, Mr. Tino Hildebrand was responsible for Global Sales and Marketing of Simatic – Siemens’ leading brand for Totally Integrated Automation before he came to Taiwan. Another major position which Mr. Hildebrand held was the head of Siemens’ Market
Management for Automotive, and he was also the author of releasing many articles about relevant production strategies for automotive, Simatic as well as Industrial Security.

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Avril Wu


senior research director of DRAMeXchange, a division of TrendForce

Ms. Wu is the research director of DRAMeXchange and is in charge of analyzing the entire DRAM industry chain from wafer suppliers to memory manufacturers and backend testing/packaging companies. Before joining TrendForce, Ms. Wu had worked for ASUSTeK and then became a member of the department of strategic marketing at SK Hynix.

Become Our Sponsor!

Sponsoring Compuforum will give your company a huge marketing advantage plus valuable media exposure!

TrendForce’s Compuforum 2018 will gather around 200 guests from around the world working in mobile-related industries, financial institutions, and international news media. Based on past experiences, we expect nearly 80% of the attendees in this year’s Compuforum to hold the position of manager or of a higher ranking.

By sponsoring this year’s Compuforum, your company will have a unique opportunity to promote its corporate brand and image. Your company will receive the exposure that can assist in building reputation and increasing market share. Sponsoring this event also offers other benefits such as exchanging crucial industry intelligence, obtaining insights on the latest market trends, and forming collaborative relationships with important decision makers.

Compuforum 2018 Pre-Event

Forum website promotion

Forum newsletter promotion

Compuforum 2018 Within Event

Forum on-site promotion

(A demo table and poster)

Compuforum 2018 Post-Event

Post-event report




Free Admission-Registration is required


Taipei International Convention Center (TICC)

  • Address: 1 Hsing-Yi Road, Section 5, Taipei City, Taiwan ROC

  • Venue: VIP Room on the 4th Floor of TICC

  • Metro: Taipei 101/World Trade Center Station, Exit 1


Event Contact

Jade Chou (For Ticketing)


+886-2-8978-6488 ext. 661

Melissa Ye (For Sponsorship)


+886-2-8978-6488 ext. 823