Frank Wei

Growth Substrate Backside Finish and Wafer-Level Laser Lift-Off Unit Processes for micro-LED Fabrications

Frank Wei received his B.S. degree from the University of California at Berkeley and Ph.D. degree from Massachusetts Institute of Technology in Materials Science and Engineering. Frank is the R&D Manager for DISCO Hi-Tec America, Inc. Currently, he is on overseas assignment in the Operation-V Department at DISCO Corporation’s headquarter R&D Center located in Tokyo Japan. Frank’s area of focus is to lead customer-centric new technology development and process integrations in areas of die singulation, thinning, and polishing for advanced packaging applications. Prior to joining DISCO, he spent 5+ years at Philips Lumileds Lighting Company’s R&D Department in San Jose, CA. At Lumileds, Frank focused on process development for chip scale packages for high-brightness LED manufacturing. Frank holds numerous processing-related patents, has authored more than 20 publications, and is actively engaged with various professional societies in the packaging field.