開場：LEDinside 2017 Micro LED 次世代顯示技術產業趨勢

繼傳統LCD（液晶）、OLED後，新一代顯示技術Micro LED吸引蘋果、索尼與全球顯示器供應鏈關注與投入。LEDinside指出，廠商間正在努力克服Micro LED的高製造成本，推動Micro LED發展。若以全面取代現有液晶顯示器的零組件的規模來推估，包括背光模組、液晶、偏光板等，Micro LED未來的潛在市場規模約可達300~400億美元。
本次簡報中將會呈現Micro LED關鍵技術發展方向涵蓋四大面向，包含磊晶與晶片技術、轉移技術、鍵結技術(Bonding)、彩色化方案等。除此之外，更會提及到Micro LED 顯示屏市場趨勢。

解決 Micro LED 在 MOCVD 製程上關鍵挑戰

(本場次恕不提供講義)

Micro LED is gaining high attraction as an emerging display technology for both wearables and TV displays due to its unique advantage in terms of color and brightness control as well as low power consumption. To displace LCD or OLED technology for these market segments, the technology will have to both fulfill technical and cost requirements. Looking throughout the value chain, both technical and commercial challenges stem from the very MOCVD processing of the wafers.
AIXTRON is presenting how the micro LED displays differ from traditional SSL application and highlights the key challenges which needs to be tackled to enable a successful MOCVD processing. Due to its sub-millimeter dimensions, micro LED’s require an advanced transfer technology and an improved wafer uniformity level. For the epitaxy processing this translates into tightened specifications in regards to wafer uniformity and defect levels. AIXTRON is presenting an unique system solution which is exactly tailored to meet this new level of challenges.

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Micro LED 量產: 以半導體生產標準製造光學元件

With our evaporation and sputtering equipment Evatec already delivers mass production solutions to the worlds leading LED manufacturers . Our broad process portfolio stretches from metal “lift off” solutions, through TCO-ITO processes, all the way to complex optical mirror stacks like full DBR layers.
Evatec ITO process know how also includes different solutions for damage-free ITO processing for green and blue Micro LED. Our new FTC (Facing-Target-Cathode) sputter source can be integrated on all Evatec cluster platforms including CLUSTERLINE® 200 and enables the combination of damage-free contact films and a highly transmissive bulk layer e.g. hot ITO.
Leveraging our long experience in optical and semiconductor process technologies, our RADIANCE sputter cluster is optimized for complex interference stacks using features like “closed-loop optical monitoring” for thickness control and “plasma emission monitoring” for perfect stoichiometry . Here we show outstanding film results up to 8” for typical low/high refractive index metal oxides.
Transferring these optical processes and know how onto semiconductor type cluster platforms enables new levels of particle performance and introduction of semiconductor.

Micro LED 製造應用：生長基板背面精密加工和晶圓級雷射剝離技術

Blue and green micro-LED fabrications usually require wafer-level laser lift-off of the epi layer from the sapphire growth substrate. The presenter will review recent process and equipment advancements in sapphire backside preparations and subsequent wafer-level lift-off processes. The discussions will focus on employing lasers using DPSS source for lift-off operations. For red colored, GaAs based mirco-LEDs, usually wafer thinning is required. The presenter will showcase recent results in GaAs wafer thinning and target thickness control for bonded wafer stacks. The technologies presented here evolved from mature processing technology platforms, hence, are ready for HVM adaptations.

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Micro LED on Silicon 在微投影相關技術的應用

我們將介紹以數位調變技術為基礎的驅動背板，並且應用在Micro LED的驅動上，以下稱為Micro LED on Silicon，微型顯示器目前因為亮度不足及功率消耗過大還有壽命等等問題，因此尚未被普遍地應用在不同的領域裡。比較起其他的微型顯示器，Micro LED on Silicon 有許多的優勢例如它的高亮度，長壽命以及省電等等好處，也因為這些優勢使得Micro LED on Silicon未來在虛擬實境及微投影等相關應用中將佔有非常重要的地位的一個元件。

Micro LED 與薄膜電晶體的整合模組於高亮度微顯示器應用

Emissive micro-LED microdisplays have been a topic of interest due to the need for high luminance levels in emerging applications, like Augmented Reality. Lumiode's technology uses III-V LED and directly integrates thin film silicon transistors to combine both efficient light emitters with active matrix circuits. We will present an overview of our technology and the need for micro-LEDs in new emerging markets.